Mounting substrate
US5350886A · kind A · utility
22Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1991 |
| Grant date | Sep 27, 1994 |
| Priority date | — |
| Expiry date | Feb 25, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/061
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An LSI mounting substrate having a multilayered thin film wiring portion, with the thin film wiring portion being divided into wiring units each composed of a plurality of wiring layers, with the wirings between the units being electrically connected through connecting pads defined in the same surface as that of a surface conductive layer of the unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.