Cluster compound microelectronic component

US5350930A · kind A · utility

Inventors

• Günter Schmid · Hemhofen, DE
• Gunter Schon · Essen, DE
• Ulrich Simon · Kahla, DE

Key dates

• Filing date: Mar 31, 1993
• Grant date: Sep 27, 1994
• Expiry date: Mar 31, 2013

Classification

• Technology area (CPC B): Performing Operations; Transporting
• CPC primary: B82Y30/00
• WIPO field: Micro-structural and nano-technology
• WIPO sector: Chemistry

Abstract

The invention relates to a microelectronic component with a component body determining the electronic properties of the component and functioning on the basis of a quantum wire or quantum point system. The the component body is formed of at least one, but in most cases a plurality of cluster molecules which adjoin one another, and the cluster molecules are formed of a metallic cluster nucleus and nonmetallic (insulating) ligand shell externally shielding and stabilizing the cluster nucleus. The cluster nucleus of the cluster molecules is formed of atoms of a transition metal, preferably silver (Ag), gold (Au), cobalt (Co), palladium (Pd), platinum (Pt), rhodium (Rh), Ruthenium (Ru).