Semiconductor assembly, in particular a remote control reception module

US5350943A · kind A · utility

Assignee

• Temic Telefunken Microelectronik · DE

Inventors

• Jorg Angerstein · Flein, DE
• Siegfried Giebler · Wüstenrot, DE
• Thomas Mistele · Ilsfeld, DE
• Werner Schairer · Weinsberg, DE
• Helmut Scheidle · Fürstenau, DE

Key dates

• Filing date: Mar 22, 1993
• Grant date: Sep 27, 1994
• Expiry date: Mar 22, 2013

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A semiconductor assembly with a metal frame configuration is described, having a semiconductor component (HL) on a carrier section (T) of a ground strip section (M). The ground strip segment has an extension section (V) with which it is extended beyond said carrier section and is both folded over in relation to said carrier section and of sufficient length that it covers said semiconductor component in order to shield it electromagnetically. In this assembly, the ground strip section has a multiple function. It is used not only for carrying and contacting of electrical components, but also acts at the same time as electromagnetic shielding for a semiconductor component, for example for the radiation detector of a remote control reception module. This shielding is dependably connected to ground since it is formed as one piece with the ground line, it is simple to manufacture since no special connecting operations are necessary, and it is space-saving since no space is required for stable connection points between the shielding and other parts of the assembly.