Method of mounting a surface-mountable IC to a converter board
US5351393A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 15, 1992 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Jul 15, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4914
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A surface-mount integrated circuit converter board assembly having a pin grid array arranged enables a conventional surface-mount lead device to be mounted for subsequent attachment to a printed circuit board. The converter board assembly includes an array of spaced apart pins, arranged in rows and columns for mounting, and a plurality of spaced apart pin pads connected thereto. The pin pads are sufficiently spaced apart to avoid interference. A set of surface-mount lead pads is part of the converter board and is interconnected to the array of pins by a plurality of lead traces. The method of making the converter board with a surface-mount integrated circuit device includes forming or reforming the leads of the device to align with the surface-mount pads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.