Acceleration sensor assembly
US5351542A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 27, 1992 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Jan 27, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P15/123
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
An acceleration sensor assembly is shown, which comprises a base board; a ceramic plate bonded to the base board, the ceramic plate having predetermined circuits printed thereon; an operational amplifier in the shape of Silicon-chip, the amplifier being mounted on the ceramic plate; an acceleration sensor proper mounted on the ceramic plate, the sensor proper being of a piezoresistance semiconductor type; a first group of bonding wires through which the operational amplifier and the circuits are connected; and a second group of bonding wires through which the acceleration sensor proper and the circuits are connected. In order to facilitate the bonding connection of the bonding wires to their associated parts, the bonding wires of the first and second groups are identical in diameter.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.