Injection molding method and apparatus with magnetic mold clamping
US5352394A · kind A · utility
29Cited by
8References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 29, 1992 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Jul 29, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29C2045/645
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A mold clamping device in an injection molding machine comprises a first platen for retaining a first mold therein and a second platen for retaining a second mold therein; a platen feeding mechanism for moving said first and second platens relative to each other on said table; electromagnetic coils arranged on the opposite surfaces of the first and second platens; and a control device for controlling the amount of the current supplied to the electromagnetic coils. The mold clamping operation is carried out using the magnetic attracting force generated by the electromagnetic coils.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.