Patent · US Expired

Use of silver alloys as cadium-free brazing solder

US5352542A · kind A · utility

9Cited by
2References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateSep 1, 1993
Grant dateOct 4, 1994
Priority date
Expiry dateSep 1, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T428/12896
  • WIPO fieldMachine tools
  • WIPO sectorMechanical engineering

Abstract

Cadmium-free brazing solders which also have working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 5 to 25 wt. % copper, 10 to 25 wt. % gallium, and 0.1 to 5 wt. % indium and/or tin.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.