Use of silver alloys as cadium-free brazing solder
US5352542A · kind A · utility
9Cited by
2References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 1, 1993 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Sep 1, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12896
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Cadmium-free brazing solders which also have working temperatures under 630.degree. C. containing 45 to 80 wt. % silver, 5 to 25 wt. % copper, 10 to 25 wt. % gallium, and 0.1 to 5 wt. % indium and/or tin.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.