Multilayer printed circuit board and production thereof
US5352762A · kind A · utility
12Cited by
15References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 28, 1991 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Mar 28, 2011 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2738
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.