Heatable transparent panel structure utilizing thermal probe having resiliently biased temperature sensor
US5352869A · kind A · utility
14Cited by
27References
4Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 8, 1994 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Feb 8, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05B2203/032
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A thermal probe for measuring and controlling the temperature of a transparent, multi-panel assembly in which one of the panels has an electrically conductive coating which serves as a radiant heat source. A sensor, urged against the panel having the coating, senses the temperature of this panel and controls a power source which powers the coating. A compressible spacing member, fitted between the sensor and the other transparent panel, urges the sensor into proximity with the panel being measured and controlled.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.