Power amplifier assembly
US5352991A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 12, 1993 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Aug 12, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A power amplifier assembly that dissipates a maximum of one thousand one hundred watts includes a power amplifier circuit and a chassis that has an overall volume of 0.02 cubic meters. The chassis includes a heat sink base that contains a mounting pattern for the power amplifier circuit. By thermally coupling the power amplifier circuit to the heat sink base via thermal coupling devices and the mounting pattern, the heat sink base dissipates a maximum of one thousand one hundred watts in a volume of 0.016 cubic meters.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.