Materials processing with a high repetition rate isotopic carbon dioxide laser
US5353296A · kind A · utility
4Cited by
6References
35Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jul 12, 1993 |
| Grant date | Oct 4, 1994 |
| Priority date | — |
| Expiry date | Jul 12, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/2232
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An laser system is disclosed for materials processing. The system includes an RF excited, conduction cooled, sealed gas laser. The lasing species in the gas mixture is an isotope of carbon dioxide and in the preferred embodiment is defined by the .sup.13 CO.sub.2 isotope. The use of the .sup.13 CO.sub.2 isotope functions to shorten the rise and fall times of the laser pulses. By this arrangement, the laser may be operated at higher repetition rates with a full depth of power modulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.