Method of manufacturing a multilayered wiring board
US5353499A · kind A · utility
2Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 19, 1993 |
| Grant date | Oct 11, 1994 |
| Priority date | — |
| Expiry date | Jul 19, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming a multilayered wiring board having a multilayered wiring structure includes the steps of forming a first mesh wiring layer having a plurality of holes therein, and forming a second wiring layer having a plurality of wirings undulating up and down so as to descend into the holes formed in the first wiring layer. In another method, the first wiring layer is formed with a plurality of protrusions and the wirings of the second wiring layer are formed between the protrusions. In the wiring boards formed according to the methods of the present invention, crosstalk between the wirings is suppressed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.