Process for manufacturing micro-mechanical sensors
US5353638A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 30, 1992 |
| Grant date | Oct 11, 1994 |
| Priority date | — |
| Expiry date | Sep 30, 2012 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01F1/6845
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for constructing a sensor, in particular an air mass sensor, is proposed, where at least one sensor element is structured from a wafer. The sensor element is separated from the wafer and placed on a substrate. In the course of structuring the sensor element by means of anisotropic etching, the outwardly located edges of the sensor element are simultaneously anisotropically etched, so that the sensor element is only connected with the wafer from which it has been structured by thin bridges, which are cut for separating the sensor element. By means of anisotropic etching an opening is made in a second wafer, which has a size corresponding to the geometric dimensions of the sensor element. To construct the sensor, the sensor element is inserted into the opening of the second wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.