Patent · US Expired

Method for connecting a wiring arranged on a sheet with another wiring arranged on another sheet by ultrasonic waves

US5354392A · kind A · utility

17Cited by
3References
22Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 13, 1993
Grant dateOct 11, 1994
Priority date
Expiry dateJan 13, 2013

Classification

  • Technology area (CPC Y)Emerging Cross-Sectional Technologies
  • CPC primaryY10T29/4913
  • WIPO fieldOther special machines
  • WIPO sectorMechanical engineering

Abstract

A method for electrically connecting an upper wiring with a lower wiring consists of the steps of arranging the upper wiring mixed with thermo-softening material on an upper insulating sheet, arranging the lower wiring mixed with thermo-softening material on a lower insulating sheet, putting the upper insulating sheet on the lower insulating sheet to bring the upper wiring into contact with the lower wiring, and providing ultrasonic vibration to the upper and lower wirings and the upper insulating sheet while pushing the upper insulating sheet toward the lower insulating sheet. In these steps, the upper and lower wirings and the upper insulating sheet are heated and melted because friction heat is generated by the ultrasonic vibration. Thereafter, the upper insulating sheet is pushed into the upper and lower wirings while pushing these wirings aside and is boded with the lower insulating sheet. Also, the upper wiring is bonded with the lower wiring so that these wirings are electrically connected.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.