Method for forming a ceramic circuit board
US5354415A · kind A · utility
37Cited by
10References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 4, 1993 |
| Grant date | Oct 11, 1994 |
| Priority date | — |
| Expiry date | Jan 4, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0789
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Method for forming a ceramic circuit board by forming a metal circuit pattern on a ceramic board through an active metal ingredient-containing brazing material and removing an unnecessary part of the brazing material by chemical liquor treatment.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.