Preparation of yeast-leavened dough crusts
US5354566A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 2, 1993 |
| Grant date | Oct 11, 1994 |
| Priority date | — |
| Expiry date | Jun 2, 2013 |
Classification
- Technology area (CPC A)Human Necessities
- CPC primaryA21D6/001
- WIPO fieldFood chemistry
- WIPO sectorChemistry
Abstract
An improved process for preparing thin, yeast-leavened dough crusts provides improved products with reduced fragility. The process comprises: preparing a dough, preferably including an antimycotic; holding the dough at a suitably low temperature which is effective to develop the dough while maintaining good forming characteristics; dividing the dough into weighed pieces; finally proofing the weighed dough pieces; pressing the weighed dough pieces between upper and lower, differentially-heated platens to form and condition a flat dough preform, the starch in the upper surface being partially gelatinized and the lower surface being strengthened. Preferably, the product baked and then packaged in a heat-sealed plastic covering.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.