Patent · US Expired

Preparation of yeast-leavened dough crusts

US5354566A · kind A · utility

37Cited by
9References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 2, 1993
Grant dateOct 11, 1994
Priority date
Expiry dateJun 2, 2013

Classification

  • Technology area (CPC A)Human Necessities
  • CPC primaryA21D6/001
  • WIPO fieldFood chemistry
  • WIPO sectorChemistry

Abstract

An improved process for preparing thin, yeast-leavened dough crusts provides improved products with reduced fragility. The process comprises: preparing a dough, preferably including an antimycotic; holding the dough at a suitably low temperature which is effective to develop the dough while maintaining good forming characteristics; dividing the dough into weighed pieces; finally proofing the weighed dough pieces; pressing the weighed dough pieces between upper and lower, differentially-heated platens to form and condition a flat dough preform, the starch in the upper surface being partially gelatinized and the lower surface being strengthened. Preferably, the product baked and then packaged in a heat-sealed plastic covering.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.