Joint, a laminate, and a method of preparing a nickel-titanium alloy member surface for bonding to another layer of metal
US5354623A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Sep 3, 1993 |
| Grant date | Oct 11, 1994 |
| Priority date | — |
| Expiry date | Sep 3, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12806
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A joint and a laminate including a nickel-titanium alloy such as Nitinol and a method for preparing the surface of a nickel-titanium alloy member for bonding solder material and, electively, another similar or dissimilar member thereto. The method includes applying a halogen containing flux to the titanium oxide coated surface of a nickel-titanium alloy member and heating the flux to its activation temperature. The flux removes and suspends the titanium oxide therein and deposits a metal from the halogen containing flux on the oxidation free surface. The activated flux also coats the member surface for protection from further oxidation. A bonding material such as a tin-silver solder is flowed onto the tinned surface to displace the activated flux. Electively, another member is applied to the molten solder to form a joint between the two members. The residual flux is cleaned from the joint to prevent further deterioration of the base metal. The solder joint includes the base nickel-titanium alloy metal, the metal from the halogen containing flux, and the solder material. Electively, any other member may be applied to this joint in the molten state to form a metallic bond therebetwee…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.