Stabilized epoxy resin compositions
US5354939A · kind A · utility
12Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 20, 1993 |
| Grant date | Oct 11, 1994 |
| Priority date | — |
| Expiry date | Dec 20, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L63/00
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Compositions comprising (a) a liquid epoxy resin, (b) a filler containing at least 50% by weight of quartz flour, (c) a polyether polyol, and (d) an organically modified sheet silicate, show a constant viscosity under thermal and mechanical stress and are suitable for applications in vacuum casting technology, especially as encapsulating material for electrical and electronic components.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.