Patent · US Expired

Multi-point probe assembly for testing electronic device

US5355080A · kind A · utility

19Cited by
7References
2Claims
0Family size

Assignee

Inventors

Key dates

Filing dateNov 17, 1993
Grant dateOct 11, 1994
Priority date—
Expiry dateNov 17, 2013

Classification

  • Technology area (CPC G)Physics
  • CPC primaryG01R1/07342
  • WIPO fieldMeasurement
  • WIPO sectorInstruments

Abstract

Probe pins are mounted on a housing in a manner which deflects the same and induces a preload therein. Upon the pins being brought into contact with a surface, the preload immediately increases the amount of contact pressure which is developed for a given amount of overdrive. In one embodiment the probe pin has both ends secured to the housing. A V-shaped portion is formed in the pin and used as the contact point. The manner in which the probe is secured, bends a portion of the pin proximate the contact point and produces a preload. As the other end is also secured, the preloading is augmented and contact point is prevented from undergoing lateral movement away from the housing on which it is secured.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.