Metal mold for sealing semiconductor devices with a resin
US5356283A · kind A · utility
10Cited by
4References
1Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 14, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Oct 14, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S425/228
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A metal mold for sealing a semiconductor device with a resin and including a shutter gate mechanism. The mold drives a shutter gate pin by using the ejection stroke of a conventional seal press, and therefore eliminates the need for an extra drive source. It follows that the mold can be implemented only if an existing facility is slightly modified, and it is lower in cost than conventional metal molds.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.