Copper foil for printed circuits and method of producing same
US5356528A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Apr 1, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12903
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A copper foil for printed circuits having a rust-preventive and heat-discoloration resistant coat, comprising a first layer of zinc or an alloy or a compound or a composition including zinc mainly, and a second layer including a silane coupling agent and phosphorus or a phosphorus compound, said second layer being positioned on the first layer. A method of producing a copper foil for printed circuits comprising the steps of treating the shiny side of a copper foil in a manner of cathode electrolysis in an alkaline solution including zinc ions and chrome ions, or providing the shiny side of a copper foil with a thin plating layer of zinc or a zinc alloy, and thereafter applying onto the treated surface of the copper foil a solution including a silane coupling agent and phosphorus or a phosphorus compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.