Heat transfer insulated parts and manufacturing method thereof
US5356661A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 29, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Mar 29, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/16195
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat transfer insulated part including a heat transfer substrate formed of a sintered metal of Cu-W or Cu-Mo, an insulating ceramic layer for electrically insulating the heat transfer substrate, formed of ceramic such as Al.sub.2 O.sub.3, SiO.sub.2 and Si.sub.3 N.sub.4, and a barrier layer provided between the heat transfer substrate and an insulating ceramic layer composed of at least either one of metal layers of W and Mo. Furthermore, preferably, an intermediate layer composed of titanium carbide and/or titanium nitride and so forth for enhancing the adhesive property between the insulating ceramic layer and the barrier layer is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.