Hydrophilic hot melt adhesives
US5356963A · kind A · utility
49Cited by
0References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 16, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Jul 16, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2666/28
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A hot melt adhesive composition comprising 5 to 50% by weight hydroxypropyl cellulose, 5 to 40% by weight plasticizer of which up to 85% may be a water insoluble plasticizer; 20 to 70% by weight tackifying resin; 0 to 40% by weight polar wax; 0 to 30% by weight compatible polymer; and, 0 to 3% by weight stabilizer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.