Coaxial wiring pattern structure in a multilayered wiring board
US5357138A · kind A · utility
43Cited by
5References
1Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 21, 1992 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | Feb 21, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/09809
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
In a thick multilayered wiring board, a coaxial signal wiring pattern is surrounded by upper and lower horizontal grounded conductive layers and vertical grounded conductive layers and the vertical conductive layers of conductive layers which surround the coaxial signal wiring pattern are formed in a photosensitive dielectric layer by a photolithography, whereby matching of characteristic impedance of the pattern is improved and thus crosstalk is reduced.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.