Self-shielding microstrip assembly
US5357218A · kind A · utility
6Cited by
1References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 3, 1993 |
| Grant date | Oct 18, 1994 |
| Priority date | — |
| Expiry date | May 3, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3431
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A shielded microstrip assembly (100)includes a substrate 102 having a first ground plane surface (106) and a second surface (206) which includes a transmission line (216). A plurality of solder balls (104) provide electrical interconnection for the ground plane and for the terminals (210) and (212) of transmission line (216). The microstrip assembly (100) is then inverted and attached using solder balls (104) to a carrier (302). The inverted microstrip assembly (100) of the present invention provides for improved shielding, while maintaining the high Q and other advantages associated with a microstrip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.