Reflow soldering apparatus
US5358166A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 7, 1993 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Apr 7, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2101/36
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A reflow soldering apparatus comprises a preheating chamber and a reflow chamber, both of which are furnished with a plurality of means for circulating a hot gas being composed of a cross flow blower, a divergent nozzle, a heater, a temperature sensor, a temperature controller, and a power regulator etc. The cross-flow blowers above a conveyer are arranged in a back to back manner and the blowers beneath the conveyer are arranged in a face to face manner, and soldering is performed by impinging the hot gas upon a circuit substrate being transferred by the conveyer. A reflow soldering apparatus having a small temperature fluctuation in the preheating chamber and the reflow chamber, high reliability in the soldering by maintaining a desired temperature profile, and preferable economy is provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.