Coating electronic substrates with silica derived from silazane polymers
US5358739A · kind A · utility
29Cited by
8References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 10, 1994 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Mar 10, 2014 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/02282
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A silica coating is formed on an electronic substrate by applying a silazane polymer on the substrate and converting it to silica by heating in an oxidizing environment. The resultant thick planarizing coatings are useful as protective coatings and dielectric inner layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.