Die-attach composition comprising polycyanate ester monomer
US5358992A · kind A · utility
53Cited by
16References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 1993 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Feb 26, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K3/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
In accordance with the present invention, there is provided a novel composition for attaching a semiconductor device to a substrate. The invention composition comprises liquid polycyanate ester monomer, electrically conductive filler rendered substantially free of catalytically active metal ions and a curing catalyst. Treatment of filler to render it free of catalytically active metal ions significantly extends the pot life of the composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.