Apparatus for bonding external leads of an integrated circuit
US5359170A · kind A · utility
19Cited by
16References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 18, 1992 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Feb 18, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A hot bar apparatus for effecting solder bonds for high density electronic components has a diamond or diamond-like (i.e. a generally diamond crystal lattice with graphite impurities) surface that makes contact with the leads of the electronic component and transmits the heat necessary to effect a solder bond. The diamond or diamond-like surface has superior wear characteristics over any other material, and it also is an electrical insulator to protect the electronic components from spurious voltages and currents generated by electrical currents that provide the heat for the hot bar.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.