Insulated lead frame for integrated circuits and method of manufacture thereof
US5359224A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jul 15, 1993 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Jul 15, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1815
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An insulated lead frame is disclosed. The preferred embodiment contains a lead over chip lead frame having an aluminum oxide insulator on portions of the power supply busses where no electrical connections will be made. The aluminum oxide may be easily deposited by an arc deposition process such as by plasma deposition. A mask prohibits the aluminum oxide from coating the places on the power supply busses where electrical connection, such as by wire bond, will be made. Wire bonds crossing over the power supply busses as they connect bond pads to the lead fingers of the lead frame are therefore less likely to short to the insulated power supply busses. A semiconductor packaged device having an aluminum oxide coating to the underside of the chip support pad is also disclosed. The aluminum oxide coating promotes adhesion between the chip support pad and the encapsulant, that is typically plastic, thereby preventing the chance of delamination and package cracking.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.