Packaging system for a standard electronic module
US5359488A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1993 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Jun 21, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/0306
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.