Cutting method and apparatus for removing a secondary coating layer from a jacketed optical fiber
US5359690A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 17, 1993 |
| Grant date | Oct 25, 1994 |
| Priority date | — |
| Expiry date | Aug 17, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T225/325
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A jacket layer of a jacketed optical fiber is cut by a cutting method and apparatus in which (A) a terminal portion of a jacketed optical fiber is straightened and grasped by a fiber holder, and (B) a blade device having (a) a pair of cutting blades and (b) a blade holder in which device cutting edges of the blades are arranged in such a manner that the edges are opposite to each other through a gap left therebetween and are on one and the same plane, the straightened portion of the jacketed optical fiber extends at a substantially right angle to the plane, and a center line of the gap between the cutting edges intersects an axis of the straightened portion of the jacketed optical fiber, and is moved in at least one direction at a substantially right angle to the axis of the straightened portion of the jacketed optical fiber to cut the secondary coating layer at a depth equal to or larger than the thickness of the secondary coating layer but smaller than the total thickness of the primary and secondary coating layers.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.