Semiconductor device-encapsulating epoxy resin composition
US5360837A · kind A · utility
30Cited by
0References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 11, 1992 |
| Grant date | Nov 1, 1994 |
| Priority date | — |
| Expiry date | Dec 11, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Disclosed is a semiconductor device-encapsulating epoxy resin composition comprising (i) an epoxy resin (A) containing at least one of a bifunctional epoxy resin (a1) having a biphenyl skeleton and a bifunctional epoxy resin (a2) having a naphthalene skeleton, (ii) a curing agent (B), and (iii) a filler containing fused silica (C) having a specified kind and specified mean particle diameter. This composition has an excellent heat resistance of solder, and further reliability after thermal cycles and reliability after solder-bath dipping.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.