Process for producing an IC-mounting flexible circuit board
US5361491A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 26, 1993 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | May 26, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An IC-mounting flexible circuit board and the process of producing the same in which the process comprises the steps of forming bump protrusions passing through a flexible circuit board to be electrically conductive with a circuit wiring pattern in such a way that the bump protrusions are allowed to protrude from the back surface of the flexible circuit board, and arranging to have the surface of each bump protrusion coated with junction metal in accordance with the structure of the protrusion, so that a bare IC chip is simply bonded to the bump protrusions of the flexible circuit board by means of heat fusion or ultrasonic bonding. An excimer laser means is preferably used for boring small holes in an insulating base to form bump protrusions, i.e., IC pad junction protrusions on the flexible circuit board. Such an IC pad junction protrusion is formed by a plating means such as soldering or the filling of a conductive member. Moreover, a reflow process is employed to form the preferably semicircular protruding portion of the IC pad junction protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.