Multiple grained diamond wire die
US5361621A · kind A · utility
5Cited by
6References
31Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 27, 1993 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | Oct 27, 2013 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB21C3/025
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A CVD diamond wire drawing die has smaller diamond grains adjacent an initial diamond growth surface with larger diamond grains adjacent an opposing surface with an opening having a wire bearing portion of substantially circular cross-section determinative of the diameter of the wire positioned more closely adjacent to the initial growth surface in a region of smaller grains than to final large grained opposing surface.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.