Electrically conductive adhesive compositions
US5362421A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 16, 1993 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | Jun 16, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2852
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An anisotropically conductive adhesive composition provides electrical conductivity between facing electrodes but maintains electric insulation laterally between adjacent electrodes and comprises (a) a cationically polymerizable monomer, such as a glycidyl epoxy resin; (b) a thermoplastic resin, essentially free of nucleophilic or metal complexing functional groups; (c) optionally, an alcohol containing material; (d) a thermally initiated catalyst system comprising: (1) a salt of an organometallic cation; (2) a cure rate enhancer; and (3) a stabilizing additive; (e) conductive particles; and (f) optionally, a silane coupling agent, wherein the adhesive compositions cure at a temperature of 120.degree.-125.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.