Method of manufacturing a pattern of conductive fine-line films and setting ink used for the same
US5362513A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 10, 1991 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | May 10, 2011 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/121
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A pattern forming method comprises at least a lower pattern forming step for printing a setting ink on a substrate, a setting step for setting the setting ink, an upper layer pattern forming step for forming a metalo-organic compound paste layer on the lower layer pattern by a printing method, and a firing step for firing at high temperature to remove the lower layer pattern. In the upper layer pattern forming step, the metalo-organic compound paste is printed so that the metalo-organic compound paste may be divided on the hardened setting ink so as to fill up gaps of the lower layer pattern. Otherwise the metalo-organic compound paste is printed on the hardened setting ink, and the metalo-organic compound paste is mechanically cut off, before the metalo-organic compound paste is dried, on the hardened setting ink, thereby forming an upper layer pattern. The setting ink comprises a thermo-setting resin, a setting agent, and an organic solvent, with an amount of nonvolatile materials of 50 to 70 wt. %, or comprises a carbon powder, a thermo-setting resin, a setting agent and an organic solvent, with an amount of nonvolatile materials of 60 to 80 wt. %.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.