Ceramic substrate
US5362551A · kind A · utility
10Cited by
3References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 31, 1994 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | Jan 31, 2014 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24926
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
A ceramic substrate is described consisting essentially of a crystallized glass and having at least one throught-hole filled with a conductor material having 100 parts by weight of copper and form 1 to 30 parts by weight of a glass having a softening point of 1,000.degree. C. or less and a thermal expansion coefficient of from 1.5.times.10.sup.-6 /K to 4.0.times.10.sup.-6 /K as measured in a temperature range of from room temperature to 400.degree. C.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.