Circuit substrate for mounting a semiconductor element
US5362926A · kind A · utility
18Cited by
4References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 24, 1992 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | Jul 24, 2012 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0355
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A circuit substrate for mounting a semiconductor element comprises an aluminum-copper clad foil laminated on a metallic base plate by interposing an insulating layer, wherein the roughness in average of the surface in contact with the insulating layer of the aluminum-copper clad foil is in a range of from 0.5 .mu.m to 50 .mu.m.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.