Packaged integrated circuit add-on card and method of manufacture
US5362985A · kind A · utility
7Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 27, 1993 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | May 27, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10704
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An add-on card which has a flat surface on the top side on which a plastic quad flat pack integrated circuit packaged integrated circuit can be soldered upon. The other side of the add-on card has downwardly protruding pins that can plug into a pin grid array integrated circuit socket. A method of manufacturing a add-on card whereby bonding pads are disposed on one side of the add-on card and pins are disposed on the other side of the add-on card.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.