Microstrip assembly
US5363067A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | May 19, 1993 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | May 19, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03B5/1847
- WIPO fieldTelecommunications
- WIPO sectorElectrical engineering
Abstract
A microstrip assembly (100), includes a first substrate such as a multilayer substrate (102, 106 and 112) having pockets or cavity areas (104). A second substrate (110) includes transmission lines (108) on its first surface, and a ground plane on its second surface which help form a microstrip resonator. The first and second substrates are attached with the transmission lines (108) resting inside of the areas defined by cavity areas (104). By providing an air gap on top of transmission lines (108), the microstrip assembly (100) can exhibit enhanced characteristics, while still maintaining the high Q characteristics of a microstrip.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.