Flip chip microfuse
US5363082A · kind A · utility
31Cited by
9References
24Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 27, 1993 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | Oct 27, 2013 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49107
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A flip chip Surface Mount Fuse is disclosed. This fuse is comprised of a generally rectangular insulating member having a groove across its full length. A fuse element is placed inside the elongated groove and thick film metallizations are provided, through printing techniques, on opposite sides of the insulating member inside the groove to secure the fuse element and to provide termination to the insulating member. The opening of the groove is filled with an electrically insulating coating. The coating can be applied to form a time delay fuse or a fast acting fuse. Fuses can be manufactured in any desired size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.