Structure and method for mounting semiconductor device
US5363277A · kind A · utility
48Cited by
1References
5Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 16, 1992 |
| Grant date | Nov 8, 1994 |
| Priority date | — |
| Expiry date | Dec 16, 2012 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The structure and method for mounting a semiconductor device, in which a wiring pattern 2 on a circuit substrate 1 and projection electrodes 5 of an integrated circuit 4 are made to be in opposition to and connected to each other, the wiring pattern 2 is connected to the projection electrodes 5 while penetrated through an adhesive and thermosetting thin film member 3 covering the wiring pattern 2; and the integrated circuit 4 is held onto the circuit substrate 1 by a hardening force of the adhesive and thermosetting thin film member 3.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.