Micro soldering system for electronic components

US5364011A · kind A · utility

Assignee

• Ford Motor Company · US

Inventors

• Jay DeAvis Baker · Dearborn, US
• Myron Lemecha · Dearborn, US
• Richard Keith McMillan · Dearborn, US
• Kenneth A. Salisbury · Livonia, US
• Paul E. Stevenson · Colorado Springs, US
• Thomas B. Merala · Canton, US
• Wells L. Green · Garden City, US
• Matti Mikkor · Ann Arbor, US
• Bernard A. Meyer · Taylor, US

Key dates

• Filing date: Apr 6, 1994
• Grant date: Nov 15, 1994
• Expiry date: Apr 6, 2014

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/3457
• WIPO field: Machine tools
• WIPO sector: Mechanical engineering

Abstract

A micro soldering apparatus and method comprising a system (10) for attaching an electronic component (12) to a substrate (14). The system (10) comprises a soldering tool (16) including a dispensing orifice assembly (18) for pulsatingly dispensing a controlled quantity of molten solder (19) to a component (12) and substrate (14) so that the component is joined to the substrate (14) mechanically and electrically upon solidification of the molten solder (19). There is no physical contact between the dispensing orifice assembly (18) and joint. The system (10) also includes a controller for the soldering tool (16). The controller functions in response to process control parameters so that the controlled quantity of molten solder (19) is dispensed through a non-oxidizing atmosphere by a pressure pulse applied to the molten solder.