Three-dimensional electroformed circuitry
US5364277A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 16, 1993 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Aug 16, 2013 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07J61/00
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
A pressure-type contact for flexible or conventional wire cable terminations is fabricated from electroformed thin metallic wafers (100) in which one wafer is plated with a raised conductive interconnection feature (122). The electrical circuitry (118, 120) is made on a stainless steel mandrel (10, 10a) having a Teflon pattern (16, 16a) on its surface that allows the desired electrical circuit (30, 32, 34, 30a, 32a, 34a, 78) to be electrolytically plated upon the conductive mandrel surface. The mandrel surface is formed with projecting features in the form of depressions (24, 24a) that will form a series of dots or raised interconnection features on the termination wafers. The mandrel also has projecting posts (76) for providing electrical connection through the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.