Method for rapid plasma treatments
US5364665A · kind A · utility
53Cited by
21References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 25, 1993 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Oct 25, 2013 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05H1/473
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A plasma treating apparatus is useful for coating substrates with thin films having vapor barrier properties at relatively rapid deposition rates. The apparatus comprises an evacuable chamber, an electrically powered electrode defining a plasma-facing surface within the chamber, and a shield spaced a distance .DELTA. transverse to the plasma-facing surface. During plasma treatments, the plasma is confined to within distance .DELTA. while a substrate is continuously fed through the confined plasma.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.