Micro-miniature structures and method of fabrication thereof
US5364742A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Sep 21, 1992 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Sep 21, 2012 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81B2201/037
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In the fabrication of a free-standing miniaturized structure in a range of about 10 to 20 .mu.m thick, a method based on a sacrificial system includes the steps of selecting a substrate material, depositing on the substrate material a sacrificial layer of material and patterning the sacrificial layer to define a shape. A photoresist layer of material is deposited on the sacrificial layer and patterned by contrast-enhanced photolithography to form a photoresist mold. Upon the mold there is plated a metallic layer of material. The electroplated structure conforms to the resist profile and can have a thickness many times that of conventional polysilicon microstructures. The photoresist mold and the sacrificial layer are thereafter dissolved using etchants to form a free standing metallic structure in a range of about 10 to 20 .mu.m thick, with vertical to lateral aspect ratios of 9:1 to 10:1 or more.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.