Composition of polyepoxide and phosphorous-containing polyepoxide

US5364893A · kind A · utility

Assignee

• Siemens Aktiengesellschaft · DE

Inventors

• Wolfgang von Gentzkow · Kleinsendelbach, DE
• Juergen Huber · Erlangen, DE
• Wolfgang Rogler · Erlangen, DE
• Dieter Wilhelm · Neu-Anspach, DE

Key dates

• Filing date: Mar 2, 1990
• Grant date: Nov 15, 1994
• Expiry date: Mar 2, 2010

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/0002
• WIPO field: Macromolecular chemistry, polymers
• WIPO sector: Chemistry

Abstract

The invention provides epoxide resin molding compositions for protectively covering semiconductor components, which are accessible in a cost-effective manner and have good processibility. The epoxide resin molding compositions provide virtually inflammable molded materials with a high glass transition temperature and a low thermal expansion coefficient without the addition of flameproofing agents, when they contain the following constituents: PA1 (A) an aromatic and/or heterocyclic polyepoxide resin which is free of phosphorous, optionally in combination with an aliphatic epoxide resin; PA1 (B) an epoxide-group-containing phosphorous compound; PA1 (c) an aromatic polyamine as a curing agent; and PA1 (D) filler material.