Molded products for molding compositions containing thermalsetting (meth)acrylate liquid resins
US5364903A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 14, 1992 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Aug 14, 2012 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F220/36
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Thermosetting (meth)acrylate molding liquid resin consisting of a specified type of unsaturated oligourethane and alkyl (meth)acrylate within a specified range of ratio. Such a specified type of unsaturated oligourethane may be obtained by reaction between 2-isocyanatoalkyl (meth)acrylate and polyhydric alcohol or by reacting 2-isocyanatoalkyl (meth)acrylate with polyhydric alcohol at molar ratio of functional groups NCO/OH between 1.1 and 1.6 to form a urethane compound and reacting hydroxyalkyl (meth)acrylate with a residual portion of 2-isocyanatoalkyl (meth)acrylate at molar ratio of functional groups OH/NCO between 1.0 and 1.5. This invention also includes molding compositions containing such liquid resin and a specified type of inorganic filler and/or a certain type of thermoplastic high molecular compound as well as molded objects obtained by curing such compositions in a mold.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.