Moulding composition comprising a thermoset component and thermoplast component
US5364914A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 13, 1991 |
| Grant date | Nov 15, 1994 |
| Priority date | — |
| Expiry date | Aug 13, 2011 |
Classification
- Technology area (CPC F)Mechanical Engineering; Lighting; Heating
- CPC primaryF05C2225/08
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable moulding composition in the form of a flowable particulate solid substantially non self-adhesive at temperatures up to 60.degree. C., flowable under shear and self-adhesive at temperatures in the range 60.degree.-150.degree. C. and hardenable at temperature over 150.degree. C., said composition comprising an uncured or partly cured thermoset resin precursor and, mixed intimately therewith, a polyarylsulphone containing the repeating units (Ph SO.sub.2 Ph).sub.n and Ph.sup.1.sub.a linked through ether and/or thioether, where Ph is paraphenylene, Ph.sup.1 is phenylene, n is 1 to 2 a is 1 to 3 and groups Ph.sup.1 are (when a exceeds 1) linked through a single chemical bond or a divalent group other than SO.sub.2 or alkylene or are fused together. Preferably the polyarylsulphone contains end-groups of formula --D--Y where D is a divalent aromatic hydrocarbon group and Y is a group reactive with the thermoset precursor and has been incipiently reacted with the thermoset precursor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.